• 775-887-1700
  • Mail@Fortuneteam.com
  • Apple St, New York, NY 10012, USA

Capabilities

Specialties Include

  • IPC 6018 Circuits-All Types and Classes
  • Precision multi layer circuit boards up to 60+ layers
  • Micro strip, strip line, and multi layer microwave circuits
  • Mixed material construction, including Teflon/FR4 assemblies
  • Single Plane/Mixed Signal designs
  • Board sizes up to 48″ x 96″
  • Electroplating unique materials, including carbon fiber composites and dielectric foam

Panel Sizes up to 48" wide X 96" long

  • Line Widths and Gaps: 2 Mil. and 2 Mil.
  • Min. hole dia.- .004″
  • Plating: Aspect Ratio: 10:1 for .008″ dia. PTH. Cu. 5 oz. plus, filled vias
  • Thickness up to .650″
  • Thin core dielectrics
  • Heavy Copper up to 40 Oz.
  • Printed resistors +/-5 percent and buried passive components.
  • Ticer and Ohmega-Ply specialists
  • Rohacell and DIAB foam fabricators

 

*Special tolerances are also available and the extent of our capabilities is only limited by design. We can provide fabrication assistance with your design, and implore you to call us with your special requests.

RF / Microwave

  • High frequency / bandwidth designs
  • Planar and screened resistors
  • Dimensions up to 48 inches wide x 96 -120 inches Long
  • Mixed dielectrics (hybrids)
  • Dielectric foam
  • Conductive paste
  • Plated cavities
  • Formed (conformal) PCBs
  • Passive and active designs
  • Thermal and conductive bonding
  • Aluminum and copper base materials
  • In-house milling and bonding
  • Externally mounted heatsinks
  • Buried metal core constructions
  • Optical CMM measurement and inspection
  • Cross section analysis and integrated coupon testing